Ranovus Inc.

Purpose

The current packaging technologies use a 2 dimensional approach where by the components are laid out on a 2 dimensional substrate and each component is connected to the adjacent component using traditional wirebonds and optical lenses. This approach worked well for low capacity components, however as the speeds go beyond 50Gb/s per lane, the capacities grow beyond 400Gb/s per module and the real-estate for such functionality shrinks, the packaging needs to move into 3D and the designs need to be matched to gain optimum yield and tolerance to process variations.